Heat Sink PCB / Al-Base PCB

Features

  • With high thermal conductivity, this PCB protects devices from thermal destruction
    (Official thermal conductivity spec: 3.0W/m, K –)
  • High tracking resistance assures safety against electricity fire. (CTI: 600V+)
  • It features high voltage endurance and assures safety for electric fire. (Through voltage: 3.0kV / 100μm)
  • UL approved (2012.06)

Product Picture

Photo: Heat Sink PCB / Al-Base PCB1
Photo: Heat Sink PCB / Al-Base PCB2

Product Specification

Item Specification Note
Surface Cu thickness 35, 70 [μm] 35 [μm] is the standard.
Insulation layer thickness 80, 100, 120 [μm] Use epoxy resin including heat dissipation filler.
100 [μm] is the standard.
Base Al thickness 0.6, 1.0, 1.5, 2.0 [mm] Base Al thickness 1.0 [mm], Al-Mg type A5052 is standard
Surface Treatment OSP (Pbf-HAL, Electroless Ni-Au) OSP is standard.
(Please contact us for Pbf-HAL, Electroless Ni-Au)
Surface Insulation Treatment Liquid photoresist, thermosetting solder resist Other than standard green, high gloss white,
mat black is available.
Other Non-through hole Circuit is only formed on the surface.
Not available for front and back conduction.

Product Properties

Item Test Condition Results
Solder Heat Resistance pretreatment (40 [°C] / 90 [%] / 96 [Hr])
: Solder floating method (260+5-0 [°C] / 20 [sec] / 2 [times])		 No floating of Cu,
delamination or inflation
Withstand Voltage Applied voltage (DC 100 [V] / 1 [min])
: Between circuits (0.1 [mm])		 No mechanical damage,
no spark over
Applied voltage (DC 5000 [V] / 1 [min])
: Between layers
Insulation Applied voltage (DC 100 [V] / 1 [min])
: Between circuits (0.1 [mm])		 More than 10 [GΩ]
Applied voltage (DC 500 [V] / 1 [min])
: Between layers
Humidity Insulation 40 [°C], 90 [% Rh], 240 [Hr], DC 100 [V], 1 [min]
: Between circuits (0.1[mm]) and between layers		 More than 100 [MΩ]
Migration Resistance 85 [°C], 85 [% Rh], DC 50 [V], 1000 [Hr]
: Between circuits (0.1[mm]) and between layers		 More than 100 [MΩ]

Above numbers are actual measurements as a reference, not assurance of quality.